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Category: Science and Technology
Date Submitted: 10/23/2012 02:56 PM
Rev. G&I.
0 Elsevier,
Therm.
Paris
(1998)
37, 781-787
Micro cooling systems for high density packaging*
Bernd Gromoll
Siemens
AC, Corporate
Technology,
Erlangen
Abstract-Future
3D electronics
packaging
systems
will require
micro
cooling
systems
that can be integrated
and permit
the
continued
use of air as a coolant.
To achieve
this, new types of silicon
micro
heat exchangers
were made using an anisotropic
etching
process.
Various
heat exchanger
configurations
and sizes were made using sandwich
and stacking
techniques.
They can
be used either as a heat exchanger
for direct cooling
with compressed
air or as a heat pipe and thermosyphon
for indirect
cooling
with fan-blown
air. The performance
characteristics
of the various
cooling
systems
are stated.
The micro-heat-pipe
can be used
for power
loss densities
of up to 3 Wcm-‘,
the direct
air cooling
up to 15 Wcm-’
and the thermosyphon
up to 25 Wcm-‘.
Cooling
performances
are achieved
that are otherwise
only possible
with liquid cooling.
The practical
application
of the micro
cooling
system
is demonstrated
using the example
of the Pentium
processor.
With a power
loss of 15 W. the high-performance
micro cooling
system
is able to limit the increase
in operating
temperature
to 15 K. The volume
of the micro heat exchanger
is
2.5 cm3 and therefore
considerably
smaller
than that of standard
heat sinks. 0 Elsevier, Paris
turbulence/
turbulence/
mass
mass
transfer
transfer
/ gas-liquid
model
interface
/ numerical
simulation
/ large
eddy
simulation
/ Navier-Stokes
equation
/ sheared
Resume
- Les futurs
systemes
de packaging
Clectroniques
3D exigeront
des micro-systemes
de refroidissement
aptes
a
I’integration
et permettant
de continuer
d’utiliser
l’air comme
agent
de refroidissement.
Pour satisfaire
a ce besoin,
on a
fabrique
de nouveaux
types de...