System-in-Package (Sip) Die Technologies Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast, 2013 - 2019

System-in-Package (SiP) Die Technologies Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast, 2013 - 2019

System in a Package (SiP) technology created multiple enhanced packaging applications to develop solutions that are capable of being customized depending on the requirement of the user. SiP is a combination of several integrated circuits (ICs) combined in a single module or package. System in a Package gives tangible gains when space reduction is considered. Although system-on-chip (SoC) fulfills the same objective further effectively, their designs are more time consuming and complex than system in a package. SiP's simplicity has unbolted a wide collection of uses for it in not less than 10 years since its origin. ICs in System in package are interconnected to each other to form a single integrated unit. Wire bond technology and flip chip technology are the two main technologies used to interconnect the chips in system in a package. Low cost of ownership is one of the major driving forces for the system-in-a-package market. Other factors driving the market growth include low cost required for development higher levels of integration, increased functionality with smaller size (as compared to separately packaged ICs) and better flexibility in product development. Also, rising demand for high performance and miniaturized electronic devices and high penetration in consumer electronics segment is expected to drive the systems in a package market. However, factors such as limited availability of resources and skills, re-alignment of electronic decision automation (EDA) processes and lack of known good die (KGD) are hampering the growth of the system in package market. The system in package market is segmented on the basis of applications into consumer electronics sector, communications sector, automotive & transportation sector, industrial sector, military, defense & aerospace (MDA) and medical sector among others. On the basis of end use,...