Semiconductor Wafer Fab Equipment Market - Global Industry Analysis and Forecast, 2014 – 2020

Semiconductor wafer fabrication is defined as process for production of photonic and electrical circuits which include LEDs, RF (radio frequency) amplifiers, and, optical computer components. Wafer fabrication helps in building components with required electrical structures. Wafer fabrication process is done for processing raw wafers to finished chips (discrete or integrated circuits). Traditional wafer fabrication process involves individual steps for resistors, transistors, conductors, and other electronic components processing on the semiconductor wafer. Semiconductor equipment plays a vital role in IC manufacturing which are located in fab, a manufacturing facility. Thus, semiconductor wafer fabrication is used to create circuits which are used in electronic and electrical devices. In semiconductor device fabrication, a wide range of processes are used to transform a “bare silicon” wafer to a circuit. These processes include PVD/CVD (physical or chemical vapor deposition), RTP (rapid thermal processing) plasma etch, photolithography, and CMP (chemical-mechanical planarization).

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Semiconductor wafer fabrication involves sequential steps of chemical and photolithographic processes which create a semiconductor device. Semiconductor device fabrication involves four steps which include processes ranging from deposition, removal to modification of electrical properties. Silicon is used to make wafers while fabrication is done. Silicon is melted, purified, and cooled to form an “ingot” which is further cut into wafers. To ensure the quality of semiconductor wafer fabrication equipment, a wafer test is done to monitor damages caused to the wafer. It helps in analyzing whether the processing can continue or not.

Factors such as growing demand from consumer electronics industry, and increasing technological advancements in telecom and semiconductor...