Global and China Ic Substrate Market Analysis and Research Report, 2015

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Global and China IC Substrate Industry Report, 2015 highlights the followings:

Status quo of semiconductor and IC packaging industry

Analysis on downstream market of IC substrate

Development trend of IC substrate

Analysis on IC substrate industry

Research on 12 IC substrate vendors

Research on 6 IC substrate peripheral companies

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IC substrate industry may be in a predicament in 2015, rooted in two aspects: first, the maturing of FOWLP; second, the tablet sales decline and sluggish smartphone growth. In addition, the prosperity of IC substrate industry in 2013 stimulated large-scale expansion of enterprises in 2014, thus leading to an insufficient rate of capacity utilization.

For FC-CSP substrate with mobile phone and tablet PC as the core market facing strong competition from FOWLP that has overwhelming superiorities including low profile, higher speed, more I/O, higher integration, less processing step, especially needing no substrate which slashes cost as IC substrate accounts for more than half of the total cost of IC.

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Although it is in its infancy without obvious cost advantage, FOWLP has been an irresistible trend, the traditional FC-CSP substrate will have to reduce the price to enter a competition, and the demand for the latter will be sharply reduced by more than 60% once FOWLP matures. So in 2015, FC-CSP substrate vendors have to substantially reduce the price to gain market advantage in advance. It is expected that in 2015 the IC substrate market will encounter a 7% scale-down to USD7.12 billion.

In the downstream market, large screen mobile phone squeezed the living...