Global and China Advanced Packaging Industry Report, 2014-2015

Bharat Book Bureau provides the report, on “Global and China Advanced Packaging Industry Report, 2014-2015”. The most popular new technologies now include FOWLP, 2.5D and TSV, which are afraid to be put into large-scale application after 2017. https://www.bharatbook.com/consumer-electronics-market-research-reports-684728/global-china-advanced-packaging.html

July 7 2015- Mumbai, India: Bharatbook.com announces a report on “Global and China Advanced Packaging Industry Report, 2014-2015”. Chinese OSAT companies, by virtue of powerful weapon of capital, enter the stage of rapid development, and will boost its scale and technical competence via more acquisitions.

Global and China Advanced Packaging Industry Report,( https://www.bharatbook.com/consumer-electronics-market-research-reports-684728/global-china-advanced-packaging.html) 2014-2015 focuses on the followings:

1 Analysis of Global Semiconductor Market and Industry

2 Analysis of Chinese Semiconductor Market and Industry

3 Technical Trends of Advanced Packaging

4 Analysis of Global and China Advanced Packaging Industry

5 Study of 24 Advanced Packaging Vendors

Global outsourced semiconductor assembly and test (OSAT) market was valued at about USD27.1 billion in 2014, expanding by 7.9% from 2013, is expected to swell by 7.0% to USD29 billion in 2015, and will further slow down to 3.8% in 2016, but start to accelerate with growth rate of 6.0% in 2017. Memory packaging and test is the largest single-product packaging and test in OSAT field, HMC and HBM are expected to spring up after 2017, accelerating the expansion of OSAT. It is predicted that SiP and ePoP will be main drivers behind OSAT growth in 2015 and 2016.

New technologies have mushroomed in OSAT field, but few of them were commercialized and used on a massive basis in recent years. The most popular new technologies now include FOWLP, 2.5D and TSV, which are afraid to be put into large-scale application after 2017. On the one hand, these new...