Ic Packaging Market in Taiwan 2015-2019

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ICs manufactured in the global semiconductor industry are delicate and vulnerable to contamination. To eliminate such eventualities, silicon chips or ICs are protected using packaging materials. Wafer-level packaging is one such packaging that involves the packaging of individual ICs using best-fit packaging processes during the semiconductor production process.

Technavio's analysts forecast the IC packaging market in Taiwan to grow at a CAGR of 2.5% over the period 2014-2019.

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Covered in this Report

This report covers the present and future scenarios of the IC packaging market in Taiwan for the period 2015-2019. Technavio uses 2014 as the base year and provides data for the 12 trailing months. To calculate market size, analysts considered the revenue generated by IC packaging vendors in Taiwan. The ICs from both domestic semiconductor and global semiconductor packaging companies were considered for calculating the market size.

However, the following were not considered while calculating market size:

Revenue from testing services

Sales of semiconductor IC packaging equipment

Sales of packaging materials

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Technavio's report, IC Packaging Market in Taiwan 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the landscape of the IC packaging market in Taiwan and its growth prospects in the coming years. The report includes a discussion on the key vendors operating in this market.

Key Vendors

Advanced Semiconductor Engineering

Powertech Technology

Siliconware Precision Industries

Other Prominent Vendors

Amkor Technology

ChipMOS Technologies

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