Semiconductor Packaging Material Market

Transparency Market Research

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Semiconductor Packaging Material

Market - Global Industry Analysis, Size,

Share, Trends and Forecast 2014 – 2020

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REPORT DESCRIPTION

Semiconductor Packaging Material Market - Global Industry Analysis, Size, Share, Trends and

Forecast 2014 – 2020

Semiconductor packaging material consists of material used for protecting electronic components such as ICs and

semiconductors from external impact, corrosion and other similar factors. These materials are used in conjunction

with various other advanced packaging technologies for packaging of integrated circuits and semiconductors.

Browse The Market Research Report of Semiconductor Packaging Material

Market : http://www.transparencymarketresearch.com/semiconductor-packaging-material-market.html

Semiconductor packaging material can be classified in eight sub-types which include bonding wires, organic

substrates, encapsulation resins, leadframes, die attach materials, ceramic packages, solder balls and thermal

interface materials amongst others. The organic substrates accounts for the largest market share in semiconductor

packaging material. Organic substrates are extensively used as base materials for semiconductor packaging.

Bonding wires have been used widely as packaging material for semiconductors, but recently there has been a shift

towards copper bonding wires for semiconductor packaging. The market for encapsulation resins is expected to

witness strong growth in the next few years since encapsulation resins are relatively novel...