Semiconductor Packaging and Assembly Equipment Market 2020 Outlook in New Research Report

Global Semiconductor Packaging and Assembly Equipment Market 2016-2020 report is the latest addition to RnRMarketResearch.com industry research reports collection. The report is about 67 pages and provides 30 Exhibits; the report is published in Jan -2016.

The analysts forecast global semiconductor packaging and assembly equipment market to grow at a CAGR of 4.68% during the period 2016-2020. For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation. The increasing application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment.

This report covers the present scenario and the growth prospects of the global semiconductor packaging and assembly equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sale of die-level and wafer-level packaging and assembly equipment to semiconductor manufacturers.

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The market is divided into the following segments based on type:

Die- level packaging and assembly equipment

Wafer-level packaging and assembly equipment

This report, Global Semiconductor Packaging and Assembly Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. This report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors - Applied Materials, ASMPT, DISCO, EVG, Kulicke and Soffa Industries, TEL, Tokyo Seimitsu

Other prominent vendors - Rudolph Technologies, SEMES, Suss Microtec, Ultratech, Ulvac...