Thermal Interface Materials Market - Global Industry Analysis, Size, Share, Trends and Forecast 2015 – 2023

Submitted by: Submitted by

Views: 10

Words: 1168

Pages: 5

Category: Business and Industry

Date Submitted: 03/08/2016 03:24 AM

Report This Essay

Transparency Market Research

Single User License:

Thermal Interface Materials Market Global Industry Analysis, Size, Share,

Trends and Forecast 2015 - 2023

USD 4315.5

Flat 10% Discount!!

Transparency Market Research

State Tower,

90, State Street, Suite 700.

Albany, NY 12207

United States

www.transparencymarketresearch.com

sales@transparencymarketresearch.com

Report will be delivered with in 15-20 working days

Free Customization as per your requirement

You will get Custom Report at Syndicated Report

price

Request Sample

Buy Now

REPORT DESCRIPTION

Transparency Market Research Reports incorporated a definite business overview and investigation inclines on “Thermal

Interface Materials Market - Global Industry Analysis, Size, Share, Trends and Forecast 2015 - 2023” This report

likewise incorporates more illumination about fundamental review of the business including definitions, requisitions and

worldwide business sector industry structure.

Thermal interface materials (TIM) are materials with high thermal conductivity, which act as an interface between the heat sink

and the heat source. The heat sink removes heat from heat source with the help of thermal interface materials. The process

involves removal of heat and release into the ambient environment by replacing the thermally insulating air between two

surfaces. Thermal interface materials possess some key properties, such as high thermal conductivity, minimum thickness, and

no leakage from the interface, which help them to deliver high thermal performance. Moreover, they add mechanical strength to

the interface between the heat sink and heat source. Thermal interface materials remove the interstitial air or gap from the

junction which acts as an insulator. They increase the conduction of heat between the surfaces in various electronic equipments.

In order to eliminate overheating in electronic equipment, they increase the conductivity of heat between a hot component and

heat spreader, thus...