Submitted by: Submitted by gongjie437
Views: 10
Words: 991
Pages: 4
Category: Science and Technology
Date Submitted: 05/01/2016 10:48 AM
Address:
Jie Gong
Phone:
Email:
1171 Westbury Drive
San Jose, CA, 95131
Cell:
1-404-425-0298
Office: 1-408-875-2721
gongjie437@gmail.com
Education
GEORGIA INSTITUTE OF TECHNOLOGY, Atlanta, Georgia, USA
Ph.D. in Mechanical Engineering
Aug. 2008~Dec. 2015
GEORGIA INSTITUTE OF TECHNOLOGY, Atlanta, Georgia, USA
Master of Science in Mechanical Engineering
Aug. 2008~Dec. 2011
SHANGHAI JIAO TONG UNIVERSITY, Shanghai, China
Bachelor of Science in Mechanical Engineering
Sep.2004~Jul. 2008
Working Experience
Aug 2014
|
Present
May 2013
|
Aug 2013
May 2012
|
Aug 2012
Aug 2008
|
Aug. 2014
Senior Application Development Engineer, LS-SWIFT Division of KLA-Tencor Corporation
Led key product demonstrations to customers, and provided technical training to field
applications engineers and other end users
Developed and implemented new applications for existing and pre-release products to
provide maximum value to the customer, including BKM (best known methods), new use
cases, technical solutions, etc
Drive tool adoption and tool evaluation at different customer sites;
Application Development Engineering Intern, SWIFT Division of KLA-Tencor Corporation
Did demo analysis foundry for customers on patterned wafer inspection using Altair 8900
and generated best-known-method (BKM)
Involved in new production development including testing plan creation, new feature
discussion regression test and alpha/beta testing
Developed a method for daily health-check for wafer inspection tool using statistical
processing control
Advanced Technology Engineering Intern, SurfScan-ADE Division of KLA-Tencor Corporation
Extended Stoney's Equation to local thin-film stress computation using high density
topography data from WaferSight and validated the results using finite element method
Analyzed the correlation between high-order-shape (HOS) metrics and wafer chuckability
under different chucking pressures, like...