Global Thermal Management Systems Market Analysis for Electronic Equipment 2014-2018

Analysts forecast the Global Thermal Management Systems Market for Electronic Equipment to grow at a CAGR of 7.66 percent over the period 2013-2018. The Report recognizes the following companies as the key players in Global Thermal Management Systems Market for Electronic Equipment.

This report covers the present scenario and the growth prospects of the Global Thermal Management System market for Electronics Equipment for the period 2013-2018.To calculate the market size, it considers the revenue generated from the sales of:

• Hardware

• Software

• Interface Materials

• Substrate

Complete Report is Available @ http://www.sandlerresearch.org/global-thermal-management-systems-market-for-electronic-equipment-2014-2018.html

Polymer composite interface materials can be easily encapsulated into small electronic equipment without compromising the functioning of the system. Polymer composite can be manufactured in different shapes and sizes, unlike metal and phase change materials. Polymer composites have high flexural strength and tensile stiffness, and are lightweight. These special properties make polymer composite materials a preferred choice for end-users. It is expected that the demand for this material will grow at a very high rate during the forecast period.

According to the report, the Global Thermal Management System market for Electronic Equipment is driven by several factors, of which the increasing demand for thermal management systems in computers is one of the major drivers. ICs, microprocessors, and miniaturized electronic components embedded inside computers generate large amounts of heat, thus creating the need for an effective thermal management system.

Further, the report states that one of the major challenges is that thermal management software is not the first choice of buyers. Computational fluid dynamics, electronic design automation, power management, and circuit board design software are used to design thermal management systems for...