Thermal Interface Materials 2015-2025: Latest Market Research Report

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Date Submitted: 03/27/2015 02:05 AM

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ResearchMoz.us includes new market research report " Thermal Interface Materials 2015-2025: Industry Size, Shares, Growth, Analysis, Trends And Forecast" to its huge collection of research reports.

Overheating is the most critical issue in the computer industry. It limits further miniaturisation, power, performance and reliability. The escalation of power densities in electronic devices has made efficient heat removal a crucial issue for progress in information, communication, energy harvesting, energy storage and lighting technologies. As long as electronic systems aren't monolithic, but are built from a wide range of materials such as metals, polymers, ceramics and semiconductors, there will be a need for thermal interface materials.

View report details with TOC at: http://www.researchmoz.us/thermal-interface-materials-2015-2025-status-opportunities-and-market-forecasts-report.html

The contact area between high power, heat generating components and heat sinks can be as low as 3%, due to the micro-scale surface roughness. Thermal interface materials are required to enhance the contact between the surfaces, and decrease thermal interfacial resistance, and increase heat conduction across the interface.

Proper selection of Thermal Interface Materials (TIM) is crucial for the device efficiency. Instead of sophisticated cooling technique, it is often better to invest in the interface material. Without good thermal contact, the use of expensive thermally conducting materials for the components is a waste.

The most appropriate choice of thermal interface material has been shown to:

Reduce total cost of ownership

Eliminate of the need for liquid cooling

Reduce system cooling power consumption

Reduce building power consumption

Increase operational lifetime

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Innovation in this industry is driven forward by:-

Faster computers: With...