Global Lead Frame Market by Manufacturers, Regions, Type and Application, Forecast to 2021

Lead Frame, as the foundation of semiconductor packaging material, is a metal frame which provides support for an integrated circuit chip or die, and with the aids of bonding material (wire, aluminum wire, copper wire), lead frame is electrical lead to interconnect the integrated circuit on the die or chip to other electrical components or contacts.

Published by: GIR (GlobalInfoResearch)

Catalog: Electronics

Publishing Date: Nov 2016

Single User License: USD 3480

Corporate Users License: USD 4680

Delivery time: 24 hours

Pages: 115

Tables and Figures: 137

Full information ：[url]http://www.globalinforesearch.com/goods.php?id=1486[url]

Scope of the Report:

This report focuses on the Lead Frame in Global market, especially in North America, Europe and Asia-Pacific, Latin America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers

SH Materials

Mitsui High-tec

SDI

Shinko

ASM Assembly Materials Limited

Samsung

POSSEHL

I-Chiun

Enomoto

Dynacraft industries

DNP

LG Innotek

Kangqiang

Hualong

Jentech

Market Segment by Regions, regional analysis covers

North America (USA, Canada and Mexico)

Europe (Germany, France, UK, Russia and Italy)

Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

Latin America, Middle East and Africa

Market Segment by Type, covers

Stamping Process Lead Frame

Etching Process Lead Frame

Others

Market Segment by Applications, can be divided into

Integrated Circuit

Discrete Device

Other

There are 13 Chapters to deeply display the global Lead Frame market.

Chapter 1, to describe Lead Frame Introduction, product scope, market overview, market opportunities, market risk, market driving force;

Chapter 2, to analyze the top manufacturers of Lead Frame, with sales, revenue, and price of Lead...