System-in-Package Die Technologies Market

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System-in-Package (SiP) Die Technologies

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REPORT DESCRIPTION

System in a Package (SiP) technology created multiple enhanced packaging applications to develop solutions that

are capable of being customized depending on the requirement of the user. SiP is a combination of several

integrated circuits (ICs) combined in a single module or package. System in a Package gives tangible gains when

space reduction is considered. Although system-on-chip (SoC) fulfills the same objective further effectively, their

designs are more time consuming and complex than system in a package. SiP's simplicity has unbolted a wide

collection of uses for it in not less than 10 years since its origin. ICs in System in package are interconnected to each

other to form a single integrated unit. Wire bond technology and flip chip technology are the two main technologies

used to interconnect the chips in system in a package.

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Low cost of ownership is one of the major driving forces for the system-in-a-package market. Other factors driving

the market growth include low cost required for development higher levels of integration, increased functionality

with smaller size (as compared to separately packaged ICs) and better flexibility in product development. Also, rising

demand for high performance and miniaturized electronic devices...