Emv Protocol

EMV

Contactless Specifications for Payment Systems

EMV Contactless Communication Protocol Specification

Version 2.0 August 2007

EMV

Contactless Specifications for Payment Systems

EMV Contactless Communication Protocol Specification

Version 2.0 August 2007

©2007 EMVCo, LLC (“EMVCo”). All rights reserved. Any and all uses of the EMV Specifications (“Materials”) shall be permitted only pursuant to the terms and conditions of the license agreement between the user and EMVCo found at http://www.emvco.com/specifications.cfm.

EMV Contactless Communication Protocol

Page ii

August 2007

EMV Contactless Communication Protocol

Revision Log – Version 2.0

The following changes have been made to this document since the publication of Version 1.1. • • • • • • • • The Operating Volume has been adapted. The RF power and signal interface requirements are defined in terms of a new version of the EMV Reference Equipment. Measurements and setup values are adapted accordingly. The maximum allowed power generated by the PCD has been reduced. The maximum Type B PCD modulation index has been reduced due to the fact that the new reference equipment measures the Type B PCD modulation index more accurately. The maximum power consumption of a PICC is measured at minimum field strength. The Type A PCD to PICC waveform timing parameters are changed to be compliant with the most recent draft version of ISO/IEC 14443-2. PICC tolerance requirements have been added for rise and fall times of the PCD to PICC modulation waveforms. The maximum load modulation amplitude is set to 80 mV for both Type A and Type B. The minimum load modulation amplitude to be generated by the PICC has been reduced. The sensitivity requirement of the PCD receiver is increased accordingly. A new protocol layer (sequence layer) has been introduced to clarify the link between the analogue and digital part of the specification. The robustness of the contactless communication against...